This is your industrial controller wish list embodied in an ultra-compact footprint. The POC-310 utilizes a DIN-rail I/O accessible chassis design that makes front I/O access a breeze. The long life cycle extended temperature industrial Atom® x7-E3850 CPU offers a huge performance increase over the previous version. Expansion is capably handled by the MezIO™ application-oriented module; a flexible and a cost-effective way to customize an embedded system for dedicated applications.
Powered by the latest Atom™ x7-E3950 quad-core processor, the POC-310 supports faster memory speeds (greater memory bandwidth) for efficient computing. Heat is managed through an exclusive mechanical design and efficient thermal pad for conducting heat from the CPU and other components efficiently. The POC-310 operates under 100% CPU load in extended temperature operating environments ranging from -25℃ to 70℃ thanks to an innovative thermal transfer system that conducts heat 10x better than traditional fanless designs. The Neousys thermal pad liquefies when heated by the CPU while springs push the CPU closer to the chassis heatsink for optimal heat transfer. The MezIO™ interface delivers expansion bus computer signals, power rails and control signals via a high-speed connector. The POC-310 MezIO™ port lets users expand and choose between MezIO modules with SATA port for 2.5″ HDD/ SSD or the SATA port combined with 4-CH isolated DI and 4-CH isolated DO. I/O includes GbE, USB 3.0/2.0, COM ports and mSATA storage.
Ultra-Compact, high performance, extended operating temperature @100% load. The 2.2 x 4.3 x 6.0 inch POC-310 excels in all 3 categories. The latest Atom™ x7-E3950 quad-core processor supports faster memory speeds (greater memory bandwidth) for more efficient computing. It delivers greater than 150% CPU and 300% GPU performance increases over the previous E3800 series platform. Communication capability is enhanced through a 1x full-size mini PCI Express slot with a USIM socket for UMTS, GSM and CDMA networks. Operating vibration at 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64). Operating shock at 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27).
The POC-310 designers made the important I/O readily accessible up front where it belongs. No more unhooking the unit from the DIN-rail or climbing around looking for an RJ-45 connector. I/O includes 3x GbE ports, 2x USB 3.0 and 2x USB 2.0 ports, and DVI-I + VGA dual display output connector. 1x Software-programmable RS-232/422/485 ports and 3x 3-wire RS-232 ports or 1x RS-422/485 port.
Column 1 Column 2 Model POC-310 System Processor Intel® Atom™ E3950 1.6/2.0 GHz quad-core processor Chipset Intel® Q370 Platform Controller Hub Graphics Integrated Intel® HD Graphics 505 Memory 1x SODIMM socket for DDR3L-1866, up to 8GB I/O Panel Ethernet 3x Gigabit Ethernet ports by Intel® I210 GbE controller USB 2x USB 3.0 ports 2x USB 2.0 ports Video 1x DVI-I connector for both analog RGB and DVI outputs Serial 1x Software-programmable RS-232/422/485 ports (COM1) 3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2) Audio 1x speaker-out 1x microphone-in I/O Internal Mini-PCIe 1x full-size mini PCI Express slot with USIM socket Storage SATA HDD 1x SATA port for 2.5" SSD/ HDD installation (optional with MezIO-R11) mSATA 1x half-size mSATA port Power DC Input 1x 3-pin pluggable terminal block for 8~35 VDC power input Remote Ctrl. & Status Output 1x 3-pin pluggable terminal block for remote control and PWR LED output Mechanical Dimensions 56 x 108 x 153 mm Weight 0.96kg Mounting Wall-mount (standard) or DIN-rail mounting (optional) Environmental Operating Temperature -25°C ~ 70°C with SSD, 100% CPU loading */** -10°C ~ 50°C with HDD, 100% CPU loading */** Storage Temperature -40°C ~ 85°C Humidity 10%~90% , non-condensing Vibration Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64) Shock Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27) Certifications CE/FCC Class A, according to EN 55022 & EN 55024 * The CPU loading is applied using Intel® Thermal Analysis Tool. **For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk (SSD) is required